OSRAM Opto Semiconductors, Inc. NEC_RGB_SGA_FOV120_F4.0

Mounting Type

Surface Mount

Package / Case

4-FBGA Module

Supplier Device Package

-

RoHS

Details

Display Resolution - Pixels

320 x 320

Interface Type

LVDS, SEIM

Number of frames per second

49 fps

Moisture Sensitive

Yes

Factory Pack QuantityFactory Pack Quantity

50

Part # Aliases

HLBX-00 Q65114A0181

Package

Tray

Mfr

ams OSRAM

Product Status

Active

Description/Function

Micro Camera Module

Dimensions

1.04 mm x 1.04 mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

-

Size / Dimension

0.041 L x 0.041 W (1.04mm x 1.04mm)

Type

CMOS

Color

RGB

Interface

LVDS, SEIM

Resolution

320 x 320

Frames per Second

used to measure frame rate – the number of consecutive full-screen images that are displayed each second.

49

Pixel Size

the horizontal and vertical measurements of an image expressed in pixels.

2.4µm x 2.4µm

Product

Camera Modules

Height (Max)

0.093 (2.36mm)