Owon Technology Lilliput Electronics (USA) Inc XDG3162

Weight

9lbs 4.1kg

Frequency(Max)

160MHz

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Series

XDG

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Function Generator, DDS

Supply Voltage

100V~240V

Function

Arbitrary, Sweep

Number of Channels

2

Display Type

LCD

Signal Types

Sine, Square, Pulse, Ramp, Noise, and Harmonic