Pulse Electronics Network E9003-004-02

Mount

Through Hole

Mounting Type

Through Hole, Right Angle

Material - Insulation

Thermoplastic

Contact Materials

Copper Alloy

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2013

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

Connector Type

CARD EDGE CONNECTOR

Number of Positions

164

Color

Black

Number of Rows

2

Gender

Female

Pitch

0.039 1.00mm

Contact Finish

Gold

Card Type

PCI Express™

Read Out

the process of removing information from an automatic device (such as a computer or sensor) and displaying it in an understandable form.

Dual

Features

Board Guide

Contact Finish Thickness

15.0μin 0.38μm

Card Thickness

0.062 1.57mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant