QCA7000-AL3B-R

Qualcomm QCA7000-AL3B-R

Part No:

QCA7000-AL3B-R

Manufacturer:

Qualcomm

Datasheet:

-

Package:

-

AINNX NO:

31978716-QCA7000-AL3B-R

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    5A992.c
  • HTS
    8542.39.00.01
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Number of Channels per Chip
    6
  • Maximum Data Rate
    10Mbps
  • PHY Line Side Interface
    No
  • JTAG Support
    Yes
  • Integrated CDR
    No
  • Standard Supported
    IEEE 1901
  • Minimum Operating Supply Voltage (V)
    1.14
  • Typical Operating Supply Voltage (V)
    1.2
  • Maximum Operating Supply Voltage (V)
    1.26
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    110
  • Supplier Temperature Grade
    Industrial
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • Power Supply Type

    There are three major kinds of power supplies: unregulated (also called brute force), linear regulated, and switching. The fourth type of power supply circuit called the ripple-regulated, is a hybrid between the “brute force” and “switching” designs, and merits a subsection to itself.

    Analog
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