Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39000Z3410A003

Factory Lead Time

12 Weeks

Mounting Type

Surface Mount

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Plastic Box with Bin Guide

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Quantity

Assorted

Kit Type

Resonators, Saw Filters