Reed Semiconductor Corp. RS31310AR

Mounting Type

Surface Mount

Package / Case

10-DFN Exposed Pad

Supplier Device Package

10-VSON (3x3)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Function

Electronic Fuse

Current - Output

5A

Accuracy

±15%