Renesas DA14586-00F02AT2

Package / Case

Axial

Mounting Type

Surface Mount

Supplier Device Package

Axial

Package

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Base Product Number

DA14586

Mfr

Renesas Design Germany GmbH

Product Status

Active

MSL

MSL 3 - 168 hours

Qualification

-

Maximum Clock Frequency

16 MHz

Number of I/Os

24 I/O

Maximum Data Rate

1 Mbps

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 85 C

Supply Voltage-Max

3.6 V

Minimum Operating Temperature

- 40 C

Supply Voltage-Min

1.7 V

Mounting Styles

SMD/SMT

Supply Current Transmitting

3.4 mA

Interface Type

I2C, SPI, UART

Supply Current Receiving

3.7 mA

Data RAM Type

SRAM

Data RAM Size

96 kB

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-65°C ~ 175°C

Series

Military, MIL-PRF-55182/01, RNC55

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

Tolerance

±0.1%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±25ppm/°C

Type

TxRx + MCU

Resistance

29.4 kOhms

Composition

Metal Film

Power (Watts)

0.125W, 1/8W

Subcategory

Wireless & RF Integrated Circuits

Technology

Si

Voltage - Supply

3.3V

Frequency

2.4GHz

Operating Frequency

Operating frequency is the frequency at which the communications are being made with the total bandwidth occupied by the carrier signal with modulation. Usually bandwidth of the antenna will be wider than the bandwidth of the signal so that more than one center frequency the antenna can be put in to effective use.

2.4 GHz

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

R (0.01%)

Interface

I2C, I2S, SPI, UART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

2Mb Flash, 64kB OTP, 128kB ROM, 96kB SRAM

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

Flash, OTP, ROM

Program Memory Size

2MB

Output Power

That power available at a specified output of a device under specified conditions of operation.

0 dBm

Data Bus Width

32bit

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

RF System on a Chip - SoC

Protocol

Bluetooth v5.0

Power - Output

0dBm

RF Family/Standard

Bluetooth

Sensitivity

-93dBm

Data Rate (Max)

-

Number of ADC Channels

4 Channel

Serial Interfaces

A serial interface is a communication interface between two digital systems that transmits data as a series of voltage pulses down a wire. Essentially, the serial interface encodes the bits of a binary number by their "temporal" location on a wire rather than their "spatial" location within a set of wires.

I²C, SPI, UART

Current - Receiving

3.7mA

Current - Transmitting

3.4mA

Modulation

-

GPIO

24

Features

Military, Moisture Resistant, Weldable

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

ARM Cortex-M0

Height Seated (Max)

--

Width

5 mm

Height

0.9 mm

Length

5 mm