Renesas Electronics HD74HC573TELL(E)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

20

ECCN (US)

EAR99

Logic Family

HC

Latch Mode

Transparent

Number of Channels per Chip

8

Number of Elements per Chip

1

Number of Inputs per Chip

8

Number of Input Enables per Element

1

Number of Selection Inputs per Element

0

Number of Outputs per Chip

8

Number of Output Enables per Element

1

Bus Hold

No

Set/Reset

No

Maximum Propagation Delay Time @ Maximum CL (ns)

19@6V|110@2V|[email protected]

Absolute Propagation Delay Time (ns)

190

Process Technology

CMOS

Maximum Low Level Output Current (mA)

7.8

Maximum High Level Output Current (mA)

-7.8

Minimum Operating Supply Voltage (V)

2

Typical Operating Supply Voltage (V)

5|2.5|3.3

Maximum Operating Supply Voltage (V)

6

Maximum Quiescent Current (uA)

4

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Standard Package Name

SOP

Supplier Package

TSSOP

Mounting

Surface Mount

Package Height

1(Max)

Package Length

6.5

Package Width

4.4

PCB changed

20

Lead Shape

Gull-wing

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP20,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

HD74HC573TELL-E

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

Part Life Cycle Code

Not Recommended

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Risk Rank

5.6

Prop.

28 ns

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

D-Type

Subcategory

FF/Latches

Packing Method

TAPE AND REEL

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.635 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

20

JESD-30 Code

R-PDSO-G20

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Output Type

3-State

Polarity

Non-Inverting

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

2/6 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Number of Bits

8

Output Characteristics

3-STATE

Logic IC Type

D LATCH

Max I(ol)

0.006 A

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS non-compliant