X28HC64P-12

Renesas Electronics America Inc. X28HC64P-12

Part No:

X28HC64P-12

Datasheet:

X28HC64

Package:

28-DIP (0.600, 15.24mm)

AINNX NO:

1748188-X28HC64P-12

Category:

Memory

Description:

IC EEPROM 64K PARALLEL 28DIP

Products specifications
  • Mounting Type
    Through Hole
  • Package / Case
    28-DIP (0.600, 15.24mm)
  • Supplier Device Package
    28-PDIP
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Voltage - Supply
    4.5V~5.5V
  • Base Part Number
    X28HC64
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    64Kb 8K x 8
  • Access Time
    120ns
  • Memory Format
    EEPROM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Write Cycle Time - Word, Page
    5ms
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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