X28HC64PZ-90

Renesas Electronics America Inc. X28HC64PZ-90

Part No:

X28HC64PZ-90

Datasheet:

-

Package:

28-DIP (0.600, 15.24mm)

ROHS:

AINNX NO:

1789695-X28HC64PZ-90

Category:

Memory

Description:

IC EEPROM 256KBIT

Products specifications
  • Mounting Type
    Through Hole
  • Package / Case
    28-DIP (0.600, 15.24mm)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • JESD-609 Code
    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    28
  • Terminal Finish
    MATTE TIN
  • Voltage - Supply
    4.5V~5.5V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    X28HC64
  • Pin Count

    a count of all of the component leads (or pins)

    28
  • JESD-30 Code
    R-PDIP-T28
  • Supply Voltage-Max (Vsup)
    5.5V
  • Supply Voltage-Min (Vsup)
    4.5V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    64K 8K x 8
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Access Time
    90ns
  • Memory Format
    EEPROM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Organization
    8KX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    5ms
  • Memory Density
    65536 bit
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    5V
  • Write Cycle Time-Max (tWC)
    5ms
  • Length
    37.4mm
  • Height Seated (Max)
    6.35mm
  • Width
    15.24mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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