RC19108A001GND#BB0

Renesas Electronics Corporation RC19108A001GND#BB0

Part No:

RC19108A001GND#BB0

Datasheet:

-

Package:

40-VFQFN Exposed Pad

AINNX NO:

70156512-RC19108A001GND#BB0

Description:

GEN6 1V8 BUFFER 8 OUTPUT WITH AM

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    40-VFQFN Exposed Pad
  • Supplier Device Package
    40-VFQFPN (5x5)
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
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