Rochester Electronics D3232

Mounting Type

Through Hole

Package / Case

DO-204AH, DO-35, Axial

Supplier Device Package

DO-35

Series

Automotive, AEC-Q101

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Box (TB)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Fast Recovery = 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

100nA @ 50V

Voltage - Forward (Vf) (Max) @ If

1V @ 100mA

Operating Temperature - Junction

175°C (Max)

Voltage - DC Reverse (Vr) (Max)

50V

Current - Average Rectified (Io)

250mA (DC)

Capacitance @ Vr, F

1.5pF @ 0V, 1MHz

Reverse Recovery Time (trr)

50ns