PEF24624EV2.1-G

Rochester Electronics PEF24624EV2.1-G

Part No:

PEF24624EV2.1-G

Datasheet:

-

Package:

0402

AINNX NO:

39237905-PEF24624EV2.1-G

Description:

IC Shdsl Transceiver LBGA-324

Products specifications
  • Package / Case
    0402
  • Mount
    Surface Mount
  • Number of Pins
    324
  • Number of Terminals
    2
  • Case Size
    0402
  • Current Sensing

    Current sensing refers to the generation of the voltage signal which is related to the current passing in the circuit.

    NO
  • Lead Spacing (nom)
    Not Required(mm)
  • Package Type
    SMD
  • Product Depth (mm)
    0.5(mm)
  • Anti-Surge
    NO
  • Operating Temp Range
    -55C to 155C
  • Case Style
    Epoxy
  • Product Diameter (mm)
    Not Required(mm)
  • Temperature Range @ Derated Power
    70 TO 155
  • Anti-Sulfurated
    NO
  • Tolerance (+ or -)
    0.1%
  • Power Rating(s)
    0.063 (1/16)(W)
  • RoHS
    Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    ±25(ppm/°C)
  • Type
    Thin Film
  • Resistance
    48700(ohm)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature
    -40 °C
  • Construction
    Rectangular
  • Military Standard
    Not Required
  • Termination Style
    PAD
  • Failure Rate

    the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

    Not Required
  • Number of Circuits
    4
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    144 kbps
  • Product Length (mm)
    1(mm)
  • Product Height (mm)
    0.3(mm)
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • Lead Free
    Lead Free
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