Mounting Type
Through Hole
Package / Case
TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO
Transistor Element Material
SILICON
Current-Collector (Ic) (Max)
100mA
Number of Elements
1
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Box (TB)
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
Terminal Finish
MATTE TIN
Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
BUILT IN BIAS RESISTOR RATIO IS 4.7
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Pin Count
a count of all of the component leads (or pins)
3
JESD-30 Code
O-PBCY-T3
Qualification Status
An indicator of formal certification of qualifications.
COMMERCIAL
Configuration
SINGLE WITH BUILT-IN RESISTOR
Power - Max
300mW
Transistor Application
SWITCHING
Polarity/Channel Type
NPN
Transistor Type
NPN - Pre-Biased
DC Current Gain (hFE) (Min) @ Ic, Vce
68 @ 5mA 5V
Current - Collector Cutoff (Max)
100nA ICBO
Vce Saturation (Max) @ Ib, Ic
300mV @ 500μA, 10mA
Voltage - Collector Emitter Breakdown (Max)
50V
Transition Frequency
250MHz
Frequency - Transition
250MHz
Resistor - Base (R1)
10 k Ω
Resistor - Emitter Base (R2)
47 k Ω
RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant