Rohm Semiconductor BM64375S-VA

Mounting Type

Through Hole

Package / Case

25-PowerDIP Module (1.134", 28.80mm)

Mfr

Rohm Semiconductor

Package

Tube

Product Status

Active

Maximum Output Current

1mA

Package Type

HSDIP25

Maximum Collector Emitter Voltage

600 V

Pd - Power Dissipation

41 W

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 115 C

Minimum Operating Temperature

- 25 C

Factory Pack QuantityFactory Pack Quantity

12

Mounting Styles

Through Hole

Manufacturer

ROHM Semiconductor

Brand

ROHM Semiconductor

RoHS

Details

Collector- Emitter Voltage VCEO Max

600 V

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Type

IGBT

Subcategory

IGBTs

Technology

Si

Pin Count

a count of all of the component leads (or pins)

25

Voltage - Isolation

1500Vrms

Configuration

3 Phase Inverter

Voltage

600 V

Current

20 A

Output Configuration

Half Bridge

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

IGBT Modules

Isolation Voltage

Isolation voltage refers to a test of the ability of an insulator to minimize the flow of electric current with a high applied voltage.

1.5kV

Motor Type

DC Motor

Product

IGBT Silicon Modules

Product Category

a particular group of related products.

IGBT Modules