ESR10EZPF4300

ROHM Semiconductor ESR10EZPF4300

Part No:

ESR10EZPF4300

Manufacturer:

ROHM Semiconductor

Package:

0805 (2012 Metric)

ROHS:

AINNX NO:

1883437-ESR10EZPF4300

Description:

RES SMD 430 OHM 1% 0.4W 0805

Products specifications
  • Factory Lead Time
    10 Weeks
  • Package / Case
    0805 (2012 Metric)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Terminal Shape
    WRAPAROUND
  • Mounting Feature

    a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

    SURFACE MOUNT
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C~155°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    ESR
  • Published
    2015
  • Size / Dimension
    0.079Lx0.049W 2.00mmx1.25mm
  • Tolerance
    ±1%
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    2
  • ECCN Code
    EAR99
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    ±100ppm/°C
  • Resistance
    430Ohm
  • Terminal Finish
    Tin (Sn) - with Nickel (Ni) barrier
  • Composition
    Thick Film
  • Power (Watts)
    0.4W 2/5W
  • Packing Method
    TR, PAPER, 7 INCH
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    400mW
  • Construction
    Chip
  • Resistor Type
    FIXED RESISTOR
  • Reference Standard
    TS 16949
  • Case Code (Metric)
    2012
  • Rated Power Dissipation (P)
    0.4W
  • Case Code (Imperial)
    0805
  • Working Voltage
    150V
  • Features
    Automotive AEC-Q200, Pulse Withstanding
  • Height
    660.4μm
  • Height Seated (Max)
    0.026 0.65mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Ratings
    AEC-Q200
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