ROHM Semiconductor RRE04EA6DFHTR

Factory Lead Time

12 Weeks

Mounting Type

Surface Mount

Package / Case

SOT-23-5 Thin, TSOT-23-5

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Series

Automotive, AEC-Q101

Published

2016

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

1μA @ 600V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 200mA

Forward Current

Current which flows upon application of forward voltage.

400mA

Operating Temperature - Junction

150°C Max

Voltage - DC Reverse (Vr) (Max)

600V

Diode Configuration

2 Independent

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant