ROHM Semiconductor TCTAL1V335M8R

Lifecycle Status

Production (Last Updated: 2 years ago)

Package / Case

3216-12

Number of Terminals

2

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

20%

DCL

1.2(uA)

Seal

Not Required

Rad Hardened

No

Seated Plane Height

Not Required(mm)

Length W/Weld

Not Required(mm)

Mounting Styles

Surface Mount

Product Diameter (mm)

Not Required(mm)

Case Style

Molded

Operating Temp Range

-55C to 125C

Wire Form

Not Required

DF

15%

Product Depth (mm)

1.6(mm)

Lead Spacing (nom)

Not Required(mm)

High Shock and Vibration

YES

Temperature Range @ Derated Voltage

85 TO 125

PackType

CUT TAPE

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

3300000PF(pF)

Construction

SMT Chip

Termination Style

INWARD L

Polarity

Polar

Voltage

35VDC

Insulation

Not Required

Case Code

AL

Product Length (mm)

3.2(mm)

Product Height (mm)

1.1(mm)