HS-QSFP-P1-02-LP
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28814859-HS-QSFP-P1-02-LP
HEAT SINK FLYOVER 6.5MM
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.