Samtec, Inc. MEC1-110-02-F-D-NP-K-TR

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Housing Material

Liquid Crystal Polymer (LCP)

Contact Materials

Beryllium Copper

Factory Pack QuantityFactory Pack Quantity

200

Series

MEC1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Number of Positions

20 Position

Number of Rows

2 Row

Pitch

1 mm

Product

Sockets

Mounting Angle

Straight