110991329

Seeed Technology Co., Ltd 110991329

Part No:

110991329

Datasheet:

110991329

Package:

-

AINNX NO:

3365000-110991329

Description:

HEAT SINK KIT FOR RASPBERRY PI 4

Products specifications
  • Material
    Aluminum, Copper
  • Package Cooled
    Raspberry Pi 4B
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Type
    Top Mount Kit
  • Attachment Method
    Adhesive
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