PQ6CB11X1CP

Sharp Microelectronics PQ6CB11X1CP

Part No:

PQ6CB11X1CP

Datasheet:

PQ6CB11X1CP

Package:

SMD/SMT

AINNX NO:

3145614-PQ6CB11X1CP

Description:

IC LED DRIVER RGLTR 250MA 6SMD

Products specifications
  • Mount
    Surface Mount
  • Package / Case
    SMD/SMT
  • Number of Pins
    6
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    1997
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    6
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    125°C
  • Min Operating Temperature
    -40°C
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    350mW
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Supply Voltage
    3.6V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Frequency
    1.4MHz
  • Number of Outputs
    1
  • Output Voltage
    30V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    5.5V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    2.7V
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    350mW
  • Topology
    Boost
  • Interface IC Type
    LED DISPLAY DRIVER
  • Length
    2mm
  • Height Seated (Max)
    0.9mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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