SM5852-003-S-3-LR

Silicon Microstructures Inc SM5852-003-S-3-LR

Part No:

SM5852-003-S-3-LR

Package:

-

AINNX NO:

69175338-SM5852-003-S-3-LR

Description:

Description: Ceramic Sensor, 1.6%, Rectangular, Through Hole Mount, DIP-8

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Mounting Feature

    a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

    THROUGH HOLE MOUNT
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    SILICON MICROSTRUCTURES INC
  • Accuracy-Max (%)
    1.6%
  • Linearity (%)
    0.5 %
  • Operating Temperature-Max
    125 °C
  • Operating Temperature-Min
    -40 °C
  • Package Shape/Style
    RECTANGULAR
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    IT ALSO HAVE ANALOG PRESSURE OUTPUT
  • Reach Compliance Code
    unknown
  • Body Length or Diameter
    15.24 mm
  • Body Breadth
    14.73 mm
  • Output Type
    DIGITAL OUTPUT
  • Termination Type
    SOLDER
  • Sensors/Transducers Type
    PRESSURE SENSOR,CERAMIC
  • Housing
    CERAMIC
  • Pressure Sensing Mode
    SINGLE ENDED
  • Output Interface Type
    I2C INTERFACE
  • Offset-Nom
    0.50V
  • Port Type

    an abstract set of operations supported by one or more endpoints.

    STRAIGHT
  • Body Height
    16.65 mm
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