CPL-WB-01D3
6-WFBGA, FCBGA
2766715-CPL-WB-01D3
IC DIRECTIONAL CPLR FLIPCHIP
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.
In telecommunications, return loss is a measure in relative terms of the power of the signal reflected by a discontinuity in a transmission line or optical fiber.
Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.