L6391DTR

STMicroelectronics L6391DTR

Part No:

L6391DTR

Manufacturer:

STMicroelectronics

Datasheet:

L6391

Package:

14-SOIC (0.154, 3.90mm Width)

ROHS:

AINNX NO:

3315483-L6391DTR

Description:

Driver 2-OUT Hi/Lo Side Half Brdg Inv/Non-Inv 14-Pin SOIC T/R

Products specifications
  • Lifecycle Status
    ACTIVE (Last Updated: 8 months ago)
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    14-SOIC (0.154, 3.90mm Width)
  • Number of Pins
    14
  • Driver Configuration
    Half-Bridge
  • Logic voltage-VIL, VIH
    1.1V 1.9V
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~150°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • JESD-609 Code
    e4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    14
  • ECCN Code
    EAR99
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    800mW
  • Voltage - Supply
    12.5V~20V
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    15V
  • Frequency
    800kHz
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Base Part Number
    L6391
  • Pin Count

    a count of all of the component leads (or pins)

    14
  • Max Output Current

    The maximum current that can be supplied to the load.

    290mA
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    15V
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    800mW
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    200 ns
  • Input Type
    Non-Inverting
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    200 ns
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    120ns
  • Fall Time (Typ)
    70 ns
  • Rise / Fall Time (Typ)
    75ns 35ns
  • Interface IC Type
    BUFFER OR INVERTER BASED MOSFET DRIVER
  • Channel Type
    Independent
  • Number of Drivers
    2
  • Gate Type
    IGBT, N-Channel MOSFET
  • Current - Peak Output (Source, Sink)
    290mA 430mA
  • High Side Driver
    YES
  • High Side Voltage - Max (Bootstrap)
    600V
  • Length
    8.65mm
  • Height Seated (Max)
    1.75mm
  • Width
    3.9mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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