STMicroelectronics RHFAC2525K02V

Lead Shape

Flat

PCB changed

14

Package Width

6.91

Package Length

9.95

Package Height

1.95(Max) + 0.38

Mounting

Surface Mount

Supplier Package

CFPAK

Standard Package Name

FPAK

Supplier Temperature Grade

Military

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-55

Maximum Power Dissipation (mW)

500

Maximum Quiescent Current (mA)

0.05

Maximum Operating Supply Voltage (V)

5.5

Typical Operating Supply Voltage (V)

5|2.5|3.3

Minimum Operating Supply Voltage (V)

2

Absolute Propagation Delay Time (ns)

8.5

Maximum Propagation Delay Time @ Maximum CL (ns)

Number of Outputs per Chip

8

Fanout

1:8

HTS

8542.39.00.01

ECCN (US)

EAR99

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Fanout Buffer

Pin Count

a count of all of the component leads (or pins)

14

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS non-compliant