STL40DN3LLH5

STMicroelectronics STL40DN3LLH5

Part No:

STL40DN3LLH5

Manufacturer:

STMicroelectronics

Datasheet:

STL40DN3LLH5

Package:

8-PowerVDFN

ROHS:

AINNX NO:

6377902-STL40DN3LLH5

Description:

MOSFET 2N-CH 30V 40A POWERFLAT56

Products specifications
  • Factory Lead Time
    14 Weeks
  • Lifecycle Status
    ACTIVE (Last Updated: 7 months ago)
  • Package / Case
    8-PowerVDFN
  • Mounting Type
    Surface Mount
  • Mount
    Surface Mount
  • Number of Pins
    5
  • Transistor Element Material
    SILICON
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    13 ns
  • Number of Elements
    2
  • Series
    STripFET™ V
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C~175°C TJ
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    6
  • ECCN Code
    EAR99
  • Resistance
    18MOhm
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    60W
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    FLAT
  • Base Part Number
    STL40
  • Pin Count

    a count of all of the component leads (or pins)

    8
  • JESD-30 Code
    R-PDSO-F6
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Dual
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ENHANCEMENT MODE
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    60W
  • Case Connection
    DRAIN
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    4 ns
  • FET Type
    2 N-Channel (Dual)
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    18m Ω @ 5.5A, 10V
  • Vgs(th) (Max) @ Id
    1.5V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    475pF @ 25V
  • Gate Charge (Qg) (Max) @ Vgs
    4.5nC @ 4.5V
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    22ns
  • Drain to Source Voltage (Vdss)
    30V
  • Fall Time (Typ)
    2.8 ns
  • Continuous Drain Current (ID)
    40A
  • Threshold Voltage
    1.5V
  • Gate to Source Voltage (Vgs)
    22V
  • Drain Current-Max (Abs) (ID)
    11A
  • Drain to Source Breakdown Voltage
    30V
  • Pulsed Drain Current-Max (IDM)
    44A
  • FET Technology
    METAL-OXIDE SEMICONDUCTOR
  • FET Feature
    Standard
  • Width
    5.75mm
  • Length
    4.75mm
  • Height
    850μm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • REACH SVHC
    No SVHC
  • Lead Free
    Lead Free
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