Taiwan Semiconductor Corporation BAS21C RFG

Factory Lead Time

24 Weeks

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Supplier Device Package

SOT-23

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Standard

Current - Reverse Leakage @ Vr

100nA @ 200V

Voltage - Forward (Vf) (Max) @ If

1.25V @ 200mA

Operating Temperature - Junction

-55°C~150°C

Voltage - DC Reverse (Vr) (Max)

250V

Current - Average Rectified (Io)

200mA

Reverse Recovery Time

50ns

Diode Configuration

1 Pair Common Cathode

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant