TSM2309CX RFG

Taiwan Semiconductor Corporation TSM2309CX RFG

Part No:

TSM2309CX RFG

Datasheet:

-

Package:

TO-236-3, SC-59, SOT-23-3

ROHS:

AINNX NO:

6387446-TSM2309CX RFG

Description:

In a Pack of 100, TSM2309CX RFG P-Channel MOSFET, 3.1 A, 60 V, 3-Pin SOT-23 Taiwan Semi

Products specifications
  • Factory Lead Time
    20 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    TO-236-3, SC-59, SOT-23-3
  • Current - Continuous Drain (Id) @ 25℃
    3.1A Tc
  • Drive Voltage (Max Rds On, Min Rds On)
    4.5V 10V
  • Power Dissipation (Max)
    1.56W Tc
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    150°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Digi-Reel®
  • Published
    2015
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30
  • FET Type
    P-Channel
  • Rds On (Max) @ Id, Vgs
    190m Ω @ 3A, 10V
  • Vgs(th) (Max) @ Id
    2.5V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    425pF @ 30V
  • Gate Charge (Qg) (Max) @ Vgs
    8.2nC @ 10V
  • Drain to Source Voltage (Vdss)
    60V
  • Vgs (Max)
    ±20V
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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