TAIYO YUDEN TMK107BJ223MA-T

Package / Case

0603

Number of Terminals

2

Product Depth (mm)

0.8(mm)

Wire Form

Not Required

Operating Temp Range

-55C to 85C

Case Style

Ceramic Chip

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Surface Mount

Temp Coeff (Dielectric)

X5R

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

20%

Rad Hardened

No

Microwave Application

NO

Seated Plane Height

Not Required(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

22000(pF)

Technology

STANDARD

Construction

SMT Chip

Termination Style

PAD

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

25VDC

Product Length (mm)

1.6(mm)

Product Height (mm)

0.8(mm)