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TDK-Epcos EPC2001
Part No:
EPC2001
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
50858353-EPC2001
Category:
Description:
Trans Gan 100V 25A Bumped Die
Products specifications
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR)
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