TE Connectivity 1600788-8

RoHS

Non-Compliant

Factory Pack QuantityFactory Pack Quantity

10

Manufacturer

TE Connectivity

Brand

TE Connectivity / AMP

Tradename

MULTI-BEAM

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Tolerance

0.1 %

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

25 ppm/°C

Resistance

80.6 kΩ

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

155 °C

Min Operating Temperature

-55 °C

Composition

Thin Film

Subcategory

Power Connectors

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

630 mW

Family

MULTI-BEAM XLE Power Connectors

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Power to the Board

Features

Moisture Resistant

Product Category

a particular group of related products.

Power to the Board

Width

1.27 mm

Height

838.2 µm

Length

2.032 mm