TE Connectivity 2-32446-1

Lifecycle Status

Production (Last Updated: 2 days ago)

Package / Case

QFN

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Material

Copper

Body Material

Copper

Product Depth (mm)

3.2(mm)

Operating Temp Range

0C to 70C

Mounting Styles

Surface Mount

Wire Size

22 to 16, 22 AWG

Voltage, Rating

300 V

Contact Materials

Copper

RoHS

Compliant

Insulation Materials

Nylon

Unit Weight

0.030865 oz

Factory Pack QuantityFactory Pack Quantity

5000

Wire Gauge Min

22 AWG

Wire Gauge Max

16 AWG

Manufacturer

TE Connectivity

Brand

TE Connectivity

Tradename

PIDG

Usage Level

Commercial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

PIDG

Type

Knife Disconnect

Color

Red

Gender

-

Subcategory

Terminals

Pin Count

a count of all of the component leads (or pins)

6

Termination Style

Crimp

ELV

Compliant

Plating

Tin

Wire Gauge (Max)

16 AWG

Wire Gauge (Min)

22 AWG

Body Plating

Tin

Sealable

No

Insulation Diameter

3.556 mm

Insulation

Insulated

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Terminals

Wire/Cable Diameter

3.56 mm

Screening Level

COMMERCIALC

Stud/Tab Size

-

Insulated Wire Support

Yes

Product

Splices

Product Category

a particular group of related products.

Terminals

Product Length

22.3 mm

Product Length (mm)

5(mm)

Width

5.16 mm

Length

22.3012 mm

Material Thickness

A measure of the distance between two surfaces of an object

787.4 µm

Product Height (mm)

0.75(mm)

Lead Free

Not Applicable