TE Connectivity 293270-7

Material

Aluminum

Shape

Square, Fins

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish

Blue Anodized

Factory Pack QuantityFactory Pack Quantity

32

Manufacturer

TE Connectivity

Brand

TE Connectivity

RoHS

Details

Series

pushPIN™

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Top Mount

Subcategory

Power

Attachment Method

Push Pin

Height Off Base (Height of Fin)

0.984 (25.00mm)

Thermal Resistance @ Forced Air Flow

4.11°C/W @ 100 LFM

Accessory Type

Bus Bar

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Lighting Connectors

Thermal Resistance @ Natural

--

Power Dissipation @ Temperature Rise

--

Product

Accessories

Product Category

a particular group of related products.

Lighting Connectors

Width

1.575 (40.00mm)

Length

1.575 (40.00mm)

Diameter

--