TE Connectivity Aerospace, Defense and Marine 2-532828-5

Lifecycle Status

ACTIVE (Last Updated: 5 days ago)

Factory Lead Time

8 Weeks

Contact Materials

Brass

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

HDI (High Density Interconnect)

Published

2009

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Power

Number of Positions

2

Number of Rows

3

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

UNDER PLATING THICKNESS: NICKEL (50)

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Current Rating (Amps)

10A

Contact Finish

Gold

Sealable

No

Contact Termination

Screw Mount

Pin or Socket

Pin

Assembly Item Name

GUIDE ITEM

Contact Finish Thickness

50.0μin 1.27μm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant