TE Connectivity Aerospace, Defense and Marine TXR21AB00-0804AI

Lifecycle Status

ACTIVE (Last Updated: 6 days ago)

Factory Lead Time

26 Weeks

Package / Case

Aluminum

Material

Aluminum Alloy

Body Material

Aluminium

Contact Finish Mating

NOT SPECIFIED

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

TXR

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Backshell, Heat Shrink Adapter

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

175°C

Min Operating Temperature

-65°C

Color

Olive Drab

Shielding

Shielded

Reach Compliance Code

not_compliant

Military Standard

MIL-DTL-26482

Shell Size - Insert

8

ELV

Non-Compliant

Plating

Cadmium

Thread Size

given in nominal sizes, not in the actual measurement.

7/16-28 UNEF

Wire/Cable Diameter

5.1 mm

Includes

6 pcs - 1 Backshell, 1 Braid, 1 O-Ring, 2 Screws, 1 Tinel Ring

Cable Exit

180°

Features

Tinel Lock

Diameter - Outside

0.711 (18.05mm)

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Not Applicable