TE Connectivity AMP Connectors 1746731-1

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

1

PCB Mounting Orientation

Vertical

Contact Materials

Brass

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2007

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Positions

1

Contact Type

Sleeve & Plunger

Orientation

Vertical

Contact Finish

Gold

ELV

Compliant

Plunger Size

0.035 0.90mm Dia

Pad Layout Dimension

Circular - 0.091 (2.30mm)

Minimum Working Height

0.102 2.60mm

Contact Finish Thickness

19.7μin 0.50μm

Stack Height (Max)

0.130 3.30mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant