1888810-2

TE Connectivity AMP Connectors 1888810-2

Part No:

1888810-2

Datasheet:

1888810-2

Package:

-

ROHS:

AINNX NO:

5640635-1888810-2

Description:

CONN DUST CAP FOR XFP/QSFP CONN

Products specifications
  • Lifecycle Status
    ACTIVE (Last Updated: 5 months ago)
  • Factory Lead Time
    5 Weeks
  • Material
    Zinc
  • Housing Material
    Plastic
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Carton
  • Published
    2009
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Orientation
    Straight
  • Depth
    22.25mm
  • ELV
    Compliant
  • Connector Support Type
    CONNECTOR ACCESSORY
  • Accessory Type
    Cap (Cover), Dust
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    10 Gbps
  • Length
    18.35mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
  • Lead Free
    Not Applicable
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