BLE60

TE Connectivity AMP Connectors BLE60

Part No:

BLE60

Datasheet:

-

Package:

-

AINNX NO:

31803584-BLE60

Description:

Products specifications
  • ECCN (US)
    5A992c.
  • HTS
    8525.60.10.50
  • Protocols Supported
    Bluetooth v5.2 (BLE)
  • Processing Unit Type
    Microprocessor
  • Maximum Data Rate (Mbps)
    1
  • Minimum Operating Frequency (MHz)
    2400
  • Maximum Operating Frequency (MHz)
    2483.5
  • Typical Sensitivity (dBm)
    -92
  • Interface Type
    GPIO/UART
  • Minimum Operating Supply Voltage (V)
    2.4
  • Typical Operating Supply Voltage (V)
    3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Antenna Mounting
    On Board
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Mounting
    Surface Mount
  • Package Height
    2.6
  • Package Width
    10.5
  • Package Length
    13.5
  • PCB changed
    18
  • Supplier Package
    SMD Module
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel|Tray
  • Type
    Module
  • Pin Count

    a count of all of the component leads (or pins)

    18
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