TE Connectivity Passive Product 4900-9020RA60

Lifecycle Status

ACTIVE (Last Updated: 1 week ago)

Factory Lead Time

19 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

DIP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

4900

Published

2009

Size / Dimension

35.10mm Lx30.00mm W

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

PC Pin

ECCN Code

EAR99

Type

Laminated Core

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8504.31.40.35

Power Rating

1.1W

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

1.1W

Termination Style

PC Pin

Max Output Current

The maximum current that can be supplied to the load.

55mA

Power - Max

1.1VA

Lead/Base Style

PC Pin

Output Voltage 1

10V

Voltage - Primary

115V 230V

Primary Winding(s)

Dual

Center Tap

In electronics, a center tap (CT) is a contact made to a point halfway along a winding of a transformer or inductor, or along the element of a resistor or a potentiometer.

No

Voltage - Secondary (Full Load)

Parallel 10V Series 20V

Output Voltage 2

10V

VA Rating

1.1 VA

Nominal Primary Voltage

115V

Nominal Secondary Voltage

5V

Height

23.6mm

Height Seated (Max)

23.60mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant