Teko Enclosures 433.15

Lifecycle Status

Production (Last Updated: 2 days ago)

Mount

Surface Mount

Voltage, Rating

50 V

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

0.1 %

Number of Terminations

2

Termination

Solder

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

10 ppm/°C

Resistance

19.6 Ω

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

155 °C

Min Operating Temperature

-55 °C

Composition

Thin Film

Power Rating

63 mW

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

63 mW

Depth

800 µm

Case Code (Metric)

1608

Case Code (Imperial)

0603

ELV

Compliant

Number of Resistors

1

Width

787.4 µm

Height

450 µm

Length

1.5494 mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No