TBP28S2708AN

Texas Instruments TBP28S2708AN

Part No:

TBP28S2708AN

Manufacturer:

Texas Instruments

Datasheet:

Package:

-

AINNX NO:

69221420-TBP28S2708AN

Description:

IC,PROM,1KX8,TTL,DIP,PLASTIC

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Rohs Code
    No
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    TEXAS INSTRUMENTS INC
  • Package Description
    DIP, DIP(UNSPEC)
  • Access Time-Max
    50 ns
  • Number of Words
    1024 words
  • Number of Words Code
    4000
  • Operating Temperature-Max
    70 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    DIP
  • Package Equivalence Code
    DIP(UNSPEC)
  • Package Style
    IN-LINE
  • Supply Voltage-Nom (Vsup)
    5 V
  • ECCN Code
    EAR99
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.71
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Reach Compliance Code
    not_compliant
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Supply Current-Max
    0.17 mA
  • Organization
    4KX4
  • Memory Width
    4
  • Memory Density
    16384 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    OTP ROM
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