Torex Semiconductor XCL220B333F-EVB-01

RoHS

Non-Compliant

Package

Box

Base Product Number

XCL220

Mfr

Torex Semiconductor Ltd

Product Status

Obsolete

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

XCL220

Tolerance

0.1 %

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

50 ppm/°C

Resistance

324 Ω

Composition

Metal Film

Power Rating

100 mW

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

100 mW

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

0.01 %

Current - Output

1A

Frequency - Switching

3MHz

Utilized IC / Part

XCL220B333FR-G

Supplied Contents

Board(s)

Board Type

Fully Populated

Main Purpose

DC/DC, Step Down

Outputs and Type

1, Non-Isolated

Regulator Topology

Buck

Features

Military, Moisture Resistant, Weldable

Width

1.78 mm

Length

3.81 mm

Lead Free

Contains Lead