Torex Semiconductor Ltd XBP06V4E4GR-G

Factory Lead Time

10 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

4-UDFN Exposed Pad

Breakdown Voltage / V

6.4V

Reverse Stand-off Voltage

5V

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Type

Zener

Applications

General Purpose

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

70W

Base Part Number

XBP06V4E

Polarity

Bidirectional

Power Line Protection

During fault, the only circuit breaker closest to the fault point should be tripped. The operating time of relay associated with protection of line should be as minimum as possible in order to prevent unnecessary tripping of circuit breakers associated with other healthy parts of power system.

No

Power - Peak Pulse

70W

Unidirectional Channels

4

Capacitance @ Frequency

40pF @ 1MHz

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant