Toshiba TC74AC573P

ECCN (US)

EAR99

HTS

8542.39.00.01

Logic Family

AC

Latch Mode

Transparent

Number of Channels per Chip

8

Number of Elements per Chip

1

Number of Inputs per Chip

8

Number of Input Enables per Element

1

Number of Selection Inputs per Element

0

Number of Outputs per Chip

8

Number of Output Enables per Element

1

Bus Hold

No

Set/Reset

No

Maximum Propagation Delay Time @ Maximum CL (ns)

8.9@5V|[email protected]

Absolute Propagation Delay Time (ns)

18.2

Process Technology

CMOS

Maximum Low Level Output Current (mA)

24

Maximum High Level Output Current (mA)

-24

Minimum Operating Supply Voltage (V)

2

Typical Operating Supply Voltage (V)

5|2.5|3.3

Maximum Operating Supply Voltage (V)

5.5

Maximum Quiescent Current (uA)

8

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Standard Package Name

DIP

Supplier Package

PDIP

Mounting

Through Hole

Package Height

3.5

Package Length

25.1(Max)

Package Width

6.4

PCB changed

20

Lead Shape

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

D-Type

Pin Count

a count of all of the component leads (or pins)

20

Output Type

3-State

Polarity

Non-Inverting

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS non-compliant