TC58NVM9S3EBAI3

Toshiba America Electronic Components TC58NVM9S3EBAI3

Part No:

TC58NVM9S3EBAI3

Package:

-

AINNX NO:

69182152-TC58NVM9S3EBAI3

Description:

Description: IC 64M X 8 FLASH 3.3V PROM, PBGA63, 8 X 13 MM, 0.80 MM PITCH, PLASTIC, TFBGA-63, Programmable ROM

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    63
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    TOSHIBA CORP
  • Part Package Code
    BGA
  • Package Description
    VFBGA,
  • Number of Words
    67108864 words
  • Number of Words Code
    64000000
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -40 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • ECCN Code
    EAR99
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.51
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8 mm
  • Reach Compliance Code
    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    63
  • JESD-30 Code
    R-PBGA-B63
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Organization
    64MX8
  • Seated Height-Max
    1 mm
  • Memory Width
    8
  • Memory Density
    536870912 bit
  • Parallel/Serial
    SERIAL
  • Memory IC Type
    FLASH
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    3.3 V
  • Length
    13 mm
  • Width
    8.5 mm
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