Toshiba Semiconductor and Storage 1SS181,LF

Factory Lead Time

12 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2014

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

125°C

Min Operating Temperature

-55°C

Base Part Number

1SS181

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Common Anode

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Standard

Current - Reverse Leakage @ Vr

500nA @ 80V

Voltage - Forward (Vf) (Max) @ If

1.2V @ 100mA

Forward Current

Current which flows upon application of forward voltage.

100mA

Operating Temperature - Junction

125°C Max

Max Reverse Voltage (DC)

80V

Average Rectified Current

Mainly used to characterize alternating voltage and current. It can be computed by averaging the absolute value of a waveform over one full period of the waveform.

100mA

Reverse Recovery Time

4 ns

Max Repetitive Reverse Voltage (Vrrm)

85V

Peak Non-Repetitive Surge Current

2A

Diode Configuration

1 Pair Common Anode

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant