TC7SPN3125CFC(T5L)

Toshiba Semiconductor and Storage TC7SPN3125CFC(T5L)

Part No:

TC7SPN3125CFC(T5L)

Datasheet:

-

Package:

6-XFDFN Exposed Pad

AINNX NO:

5599521-TC7SPN3125CFC(T5L)

Description:

DUAL SUPPLY BUS BUFFER UNI CST6C

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    6-XFDFN Exposed Pad
  • Supplier Device Package
    CST6C
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    TC7SP
  • Published
    2014
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Output Type
    Tri-State, Non-Inverted
  • Number of Circuits
    1
  • Channel Type
    Unidirectional
  • Translator Type
    Voltage Level
  • Voltage - VCCA
    1.1V~2.7V
  • Voltage - VCCB
    1.65V~3.6V
  • Channels per Circuit
    1
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