Vishay J309-TR1-E3

ECCN (US)

EAR99

Channel Mode

Depletion

Number of Elements per Chip

1

Maximum Gate Source Voltage (V)

-25

Maximum Gate Source Leakage Current (nA)

1

Maximum IDSS (uA)

30000

Maximum Drain Source Resistance (mOhm)

35000(Typ)

Typical Input Capacitance @ Vds (pF)

4@10V

Typical Reverse Transfer Capacitance @ Vds (pF)

1.9@10V

Typical Forward Transconductance (S)

0.014

Maximum Power Dissipation (mW)

350

Typical Power Gain (dB)

16

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Standard Package Name

TO-92

Supplier Package

TO-92

Military

No

Mounting

Through Hole

Package Height

4.7(Max)

Package Length

4.7

Package Width

3.68

PCB changed

3

Lead Shape

Formed

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

JFET

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single

Channel Type

N

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant