Vishay / Dale BZD27C5V1P-GS08

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mount

Surface Mount

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

2

Diode Element Material

SILICON

Number of Terminals

2

Breakdown Voltage / V

6 V

RoHS

Compliant

Package Description

R-PDSO-F2

Package Style

SMALL OUTLINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

40

Reference Voltage-Nom

5.1 V

Operating Temperature-Max

150 °C

Manufacturer Part Number

BZD27C5V1P-GS08

Power Dissipation (Max)

0.8 W

Package Shape

RECTANGULAR

Manufacturer

Vishay Semiconductors

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

VISHAY SEMICONDUCTORS

Risk Rank

5.29

Part Package Code

DO-219AB

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Digi-Reel®

Tolerance

6 %

JESD-609 Code

e3

Pbfree Code

Yes

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150 °C

Min Operating Temperature

-55 °C

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8541.10.00.50

Subcategory

Voltage Reference Diodes

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

800 mW

Technology

ZENER

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

2

JESD-30 Code

R-PDSO-F2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Polarity

UNIDIRECTIONAL

Configuration

SINGLE

Impedance

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

6 Ω

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Diode Type

ZENER DIODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

800 mW

Max Reverse Leakage Current

5 µA

Test Current

100 mA

Zener Voltage

5.1 V

Voltage Tol-Max

5.88%

JEDEC-95 Code

DO-219AB

Working Test Current

100 mA

Voltage Tolerance

The voltage tolerance level for the electrical auxiliaries is defined by the standard. The maximum and minimum nominal voltages are defined by the tolerance level.

6 %

ESD Protection

No

Width

1.9 mm

Height

1.08 mm

Length

2.9 mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

Lead Free

Lead Free